Embedded World 2026

Companies across the semiconductor value chain and their downstream industries are navigating a profound transformation. They must deliver faster, more efficient, and more sustainable innovation while managing rising design complexity and growing expectations for integrated hardware‑plus‑software solutions. At the same time, automotive, defense, industrial, and high‑tech players are racing toward software‑defined products, edge devices, physical AI and robotics that demand higher performance at lower power, stronger security, and the ability to evolve continuously through software and AI‑driven features.

For many of our clients, the real challenge lies in bringing these demands together. Aligning embedded software, silicon, and intelligent engineering at scale is essential to staying competitive; but increasingly difficult to achieve in fragmented environments and traditional development cycles.

That is why Embedded World 2026 matters for our clients. It is where the global ecosystem shaping next‑generation embedded systems comes together, offering a clear view of the technologies and engineering approaches that will define tomorrow’s products. When Capgemini joins this community in Nuremberg in March 2026, we do so to help clients translate this transformation into action – showing how hardware, software, and AI converge into seamless, future‑ready solutions.

This is what embedded intelligence really feels like.

Visit us in Hall 4, booth #4-508

Our industry and product experts will showcase how organizations can combine embedded software, silicon innovation, and AI‑driven engineering to create secure, scalable, and sustainable solutions.

Embedded Software

We create smarter, safer, and more connected products by developing advanced embedded platforms, software architectures, and real‑time systems that enable software‑defined innovation from chip-2-cloud at scale.

Silicon Innovation

We support the full semiconductor lifecycle – from architecture and IC design to verification. We drive chiplet‑based solutions and conduct sustainability assessment – helping clients accelerate performance while managing cost, risk, and energy efficiency.

Our expertise spans cutting-edge domains such as RISCV architectures, High Performance Computing (HPC), and advanced materials like SiC and GaN for power electronics. We enable secure and future-ready designs with Post Quantum Cryptography, and drive intelligence at every level through Embedded AI, Edge AI, and sustainable AI strategies.

AI-Driven Engineering

We harness the power of Automation, AI, and Generative AI to transform the entire product development lifecycle – from initial specification through design, verification, and validation, all the way to GDSII. By integrating digital twins, AI-assisted design, automated verification, and intelligent development tools, we enable engineering teams to accelerate workflows, enhance quality, and deliver breakthrough innovations faster and more efficiently.

Meet our experts

Meet us at Embedded World 2026 and explore how we help clients unite silicon innovation, embedded intelligence, and AI‑driven engineering to build the secure, sustainable, and software‑defined products of tomorrow. We look forward to welcoming you at our booth #4 508 in Hall 4.

Please fill out the form below to schedule a meeting with our experts